Plastics are very manufacturable and light, but they have a main disadvantage of not transferring heat well. This is a problem in applications where plastics are encapsulating electronics and the electronic device is dissipating a lot of heat that cannot escape. This leads to poor performance and a reduced lifetime. A new “super plastic” that can direct heat away from its source opens up a wide range of possibilities for making more efficient electronic devices. University of Michigan engineering professors Jinsang Kim and Kevin Pipe are leading teams that are using hydrogen bonding from two different liquid polymers to regenerate a continuous pathway for heat transfer. The plastic blend dissipates heat ten times better than its conventional counterpart.