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Product Spotlight: Supreme 3HTND-2DM
Added Jan 1, 2017 | Rate View top rated
Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill. This video demonstrates the process of dispensing the epoxy paste and creating a barrier, or “dam”, which can then be filled by a flowable encapsulant. This thermally conductive compound also meets NASA low outgassing specifications and can withstand 1,000 hours at 85°C/85% RH.
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